CONDUCTIVE PASTE

CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide a conductive paste of high conductivity corresponding to a fine pitch. SOLUTION: The conductive paste comprises metal powder, thermosetting resin containing epoxy resin, and a flux active compound having a carboxyl group and a phenolic hydroxyl group as raw materials...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOMATA HIROSHI, HATANO HARUYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a conductive paste of high conductivity corresponding to a fine pitch. SOLUTION: The conductive paste comprises metal powder, thermosetting resin containing epoxy resin, and a flux active compound having a carboxyl group and a phenolic hydroxyl group as raw materials, wherein the metal powder consists of copper, and the flux active compound having a carboxyl group and a phenolic hydroxyl group is contained by ≥0.1 wt.% and ≤5.0 wt.% based on 100 wt.% of the metal powder. COPYRIGHT: (C)2009,JPO&INPIT