RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE

PROBLEM TO BE SOLVED: To provide a resin for optical semiconductor element encapsulation containing a polyborosiloxane, which is excellent in all of heat resistance, transparency and light resistance, and to provide an optical semiconductor device encapsulated with the resin for optical semiconducto...

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Bibliographische Detailangaben
Hauptverfasser:	AKAZAWA MITSUHARU, KATAYAMA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin for optical semiconductor element encapsulation containing a polyborosiloxane, which is excellent in all of heat resistance, transparency and light resistance, and to provide an optical semiconductor device encapsulated with the resin for optical semiconductor element encapsulation containing the polyborosiloxane. SOLUTION: The present invention discloses: a resin for optical semiconductor element encapsulation containing the polyborosiloxane obtained by reacting a silicon compound with a boron compound; and a light emitting diode device having an optical semiconductor element encapsulated with the resin for optical semiconductor element encapsulation containing the polyborosiloxane. COPYRIGHT: (C)2009,JPO&INPIT