THERMOPLASTIC RESIN FILM

PROBLEM TO BE SOLVED: To provide a mono-layered or multi-layered thermoplastic film which is excellent in an antistatic property, and especially has improved sustainability thereof with the passage of time. SOLUTION: This mono-layered film of a thermoplastic resin containing an antistatic agent or a...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI NAOZUMI, HASHIMOTO HIDENORI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HANDLING THIN OR FILAMENTARY MATERIAL INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mono-layered or multi-layered thermoplastic film which is excellent in an antistatic property, and especially has improved sustainability thereof with the passage of time. SOLUTION: This mono-layered film of a thermoplastic resin containing an antistatic agent or a multi-layered film having the resin layer is characterized in that at least one side of the thermoplastic resin containing the antistatic agent is subjected to a polar group-imparting treatment. The film can suitably be used for packing a wide range of articles such as foods, medicines and fiber products, and is especially useful as a packing material, a bag material, or a container material for precision electronic parts such as semiconductor elements, in particular, as a cover tape material for carrier tapes for receiving IC chips. COPYRIGHT: (C)2009,JPO&INPIT