SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of suppressing variations in joint property in two joined portions when simultaneously joining two joint portions by simultaneously applying ultrasonic vibrations to the two joint portions positioned at different height...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	USUDA OSAMU, KISHIMOTO MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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