SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of suppressing variations in joint property in two joined portions when simultaneously joining two joint portions by simultaneously applying ultrasonic vibrations to the two joint portions positioned at different heights. SOLUTION: There are provided a cylindrical body 10, a first projecting part 11 provided on the external peripheral surface of the cylindrical body 10 and in which ultrasonic vibrations are propagated through the cylindrical body 10, and a second projecting part 12 provided on the external peripheral surface of the cylindrical body 10 with an amount of projection different from that of the first projecting part and in which ultrasonic vibrations are propagated through the cylindrical body 10, wherein the distance between the axial center of the cylindrical body 10 and the tip end of the first projecting part 11 and the distance between the axial center of the cylindrical body 10 and the tip end of the second projecting part 12 are substantially the same. COPYRIGHT: (C)2009,JPO&INPIT