CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a ceramic package that can clearly distinguish an edge inside a surface conductor layer from a conductive layer, and to provide a method of manufacturing the same. SOLUTION: A first conductive layer 21 is formed on a cavity 5 side surface (upper surface) of a lower c...

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Bibliographische Detailangaben
1. Verfasser: MAEHARA SHINJI
Format: Patent
Sprache:eng
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