CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a ceramic package that can clearly distinguish an edge inside a surface conductor layer from a conductive layer, and to provide a method of manufacturing the same. SOLUTION: A first conductive layer 21 is formed on a cavity 5 side surface (upper surface) of a lower c...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a ceramic package that can clearly distinguish an edge inside a surface conductor layer from a conductive layer, and to provide a method of manufacturing the same. SOLUTION: A first conductive layer 21 is formed on a cavity 5 side surface (upper surface) of a lower ceramic board 13 along one longer inner side of a frame 19, and the right end of this first conductive layer 21 extends to the upper right corner part of the ceramic package 1. The surface of the first conductive layer 21's central part is covered with an insulating layer 25 made of aluminum. In other words, when the ceramic package 1 is seen from the cavity 5's side (upper surface side), the insulating layer 25 is formed along the longer inner side of the frame 19 so that the first conductive layer 21 may not be exposed. This makes the insulating layer 25 look to be as if it were formed adjacent to the inner side of the frame 19 when seen from the upper surface side, and the first conductive layer 21 is seen between the frame 19 and the insulating layer 25. COPYRIGHT: (C)2009,JPO&INPIT |
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