ADHESIVE SHEET, DICING DIE BONDING TAPE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an adhesive sheet less likely to cause the protrusion of adhesive sheet and the defective embedding of bonding wires during embedding bonding wires, and to provide a cured product having excellent heat resistance. SOLUTION: The adhesive sheet 3 is used for bonding a...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEBE YOSHIYUKI, WATABE KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive sheet less likely to cause the protrusion of adhesive sheet and the defective embedding of bonding wires during embedding bonding wires, and to provide a cured product having excellent heat resistance. SOLUTION: The adhesive sheet 3 is used for bonding a semiconductor chip 2 so that parts of the bonding wires 7a and 7b are embedded in the adhesive sheet 3 on a substrate member 1 in which the bonding wires 7a and 7b are connected to the upper side 1a. The adhesive sheet 3 comprises: a flexible epoxy resin (A1); an epoxy group-containing a polymer (A2); an epoxy resin (A3) except the flexible epoxy resin (A1) and the high-molecular polymer (A2); and a curing agent (B), wherein the adhesive sheet 3 has a viscosity of 500-5,000 Pa s at a temperature when the parts of the bonding wires 7a and 7b are embedded in the adhesive sheet 3. COPYRIGHT: (C)2009,JPO&INPIT