SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a reliable semiconductor device which neither forms a void nor expose wirings in a structure where a semiconductor element is flip-chip mounted on a wiring board with a resin film interposed. SOLUTION: The semiconductor device has a semiconductor element 1 having an electrode pad 1a on a main surface, the wiring board 3 having an electrode portion 31a etc., electrically connected to the electrode pad 1a of the semiconductor element 1 on a top surface, and a resin portion 2 sealing the gap between the semiconductor element 1 and wiring board 3. The wiring board 3 has a protection film 4 having an opening 5 exposing a mounting region for the semiconductor element 1, and the opening 5 of the protection film 4 is minimum in distance to the semiconductor element 1 at parts corresponding to four corner portions of the semiconductor element and maximum in distance to the semiconductor element at parts corresponding to center portions of respective sides of the semiconductor element 1, and completely resin-sealed with a resin portion 2. The opening 5 is completely resin-sealed and in a shape such that air is hardly confined, so void formation and wiring exposure are suppressed to improve the reliability. COPYRIGHT: (C)2009,JPO&INPIT