INTERCONNECTION BOARD AND THREE-DIMENSIONAL CIRCUIT DEVICE EMPLOYING IT

INTERCONNECTION BOARD AND THREE-DIMENSIONAL CIRCUIT DEVICE EMPLOYING IT

PROBLEM TO BE SOLVED: To provide an interconnection board having a housing structure of small warpage, and to provide a three-dimensional circuit device using the interconnection board and exhibiting excellent reliability. SOLUTION: The interconnection board comprises an insulating housing 10 having...

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Bibliographische Detailangaben
Hauptverfasser: MORI MASAHITO, YAGI TAKAHIKO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an interconnection board having a housing structure of small warpage, and to provide a three-dimensional circuit device using the interconnection board and exhibiting excellent reliability. SOLUTION: The interconnection board comprises an insulating housing 10 having a hole 11 on the inside, and a plurality of connection terminal electrodes 12 provided oppositely on the first surface 10a and the second surface 10b of the housing 10 and interconnected through the inner circumferential side face 10c wherein the housing 10 has a protrusion 13 thinner than the housing 10 at least in a part of the outer circumferential side face 10d thereof. COPYRIGHT: (C)2009,JPO&INPIT