IC TAG

PROBLEM TO BE SOLVED: To provide an IC tag which can be used even under a harsh environment which is heavily damaged by heat than a conventional use environment. SOLUTION: This IC tag is provided with an IC inlet 3 including an IC chip 14 storing electronic information; a resin-made sealing member 3...

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Bibliographische Detailangaben
1. Verfasser: ISHIGAKI FUMIHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an IC tag which can be used even under a harsh environment which is heavily damaged by heat than a conventional use environment. SOLUTION: This IC tag is provided with an IC inlet 3 including an IC chip 14 storing electronic information; a resin-made sealing member 30 for sealing the IC inlet; and an inorganic material-based heat-insulating member 40 formed so that the resin-made sealing member can be covered as a whole, and configured of an inorganic material-based powder. COPYRIGHT: (C)2009,JPO&INPIT