CUTTING DEVICE AND CUTTING METHOD

PROBLEM TO BE SOLVED: To provide a cutting device which is improved in cutting locational accuracy of a bookbinding bundle. SOLUTION: A bookbinding device is configured such that each of cut surfaces of the bookbinding bundle is cut a plurality of times. The bookbinding device has: a cutting blade 1...

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Bibliographische Detailangaben
Hauptverfasser: NOJI TOSHIAKI, HONMOCHI HIROKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cutting device which is improved in cutting locational accuracy of a bookbinding bundle. SOLUTION: A bookbinding device is configured such that each of cut surfaces of the bookbinding bundle is cut a plurality of times. The bookbinding device has: a cutting blade 120a for cutting an edge of the bookbinding bundle; a turning table 121 and a gripper 122 for turning the bookbinding bundle to change the cut surface; and an elevation mechanism 121a and a unit frame 122c for moving the bookbinding bundle toward the cutting blade 120a. The cutting blade 120a does not continuously cut the same cut surface of the bookbinding bundle except for the cut surface to be cut in a last step. COPYRIGHT: (C)2009,JPO&INPIT