CHUCK FOR PROBE STATION

PROBLEM TO BE SOLVED: To provide a chuck, such that an upper part chuck assembly element for supporting a wafer will not lose flatness, when a probe is loaded on a wafer. SOLUTION: A chuck includes an upper part chuck assembly element 180 having an upper face 198 for supporting a wafer. Between the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	DUNKLEE JOHN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING
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