CHUCK FOR PROBE STATION

PROBLEM TO BE SOLVED: To provide a chuck, such that an upper part chuck assembly element for supporting a wafer will not lose flatness, when a probe is loaded on a wafer. SOLUTION: A chuck includes an upper part chuck assembly element 180 having an upper face 198 for supporting a wafer. Between the...

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Bibliographische Detailangaben
1. Verfasser: DUNKLEE JOHN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a chuck, such that an upper part chuck assembly element for supporting a wafer will not lose flatness, when a probe is loaded on a wafer. SOLUTION: A chuck includes an upper part chuck assembly element 180 having an upper face 198 for supporting a wafer. Between the upper part chuck assembly element and a central chuck assembly element 182 thereunder, three independent pins 200,202, and 204 are provided forming spacing. A chuck alienating device is provided, connected to the upper part chuck assembly element 180. The chuck alienation device includes an insulated U-shaped member 246 having a first face which pushes to engage into the upper face 224 of the central chuck assembly element and a second face which pushes, to be engaged into a first face of a conductive U-shaped member 244. A second face of the conductive U-shaped member 244 pushes to be engaged into a lower face of the upper part chuck assembly element. The first face of the insulated U-shaped member is thinner than one third of the thickness of the conductive U-shaped member. COPYRIGHT: (C)2009,JPO&INPIT