ELECTRODE CONNECTION STRUCTURE OF WAFER HOLDER

PROBLEM TO BE SOLVED: To provide a wafer holder that can have sufficient bonding strength and prevent cracking of a joint portion between a metal-made member and a ceramic-made member, and has high reliability. SOLUTION: A ceramic-made wafer holder has a buried electrode 2 between an upper ceramic s...

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Bibliographische Detailangaben
Hauptverfasser: NISHIMOTO NOBUHIRO, NAKANISHI SHUSUKE, NAKADA HIROHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wafer holder that can have sufficient bonding strength and prevent cracking of a joint portion between a metal-made member and a ceramic-made member, and has high reliability. SOLUTION: A ceramic-made wafer holder has a buried electrode 2 between an upper ceramic substrate 1 and a ceramic substrate 3, and a ceramic base body 3 is joined to the opposite side therefrom. A surface-metallized ceramic-made connection terminal 5a made of the same material with the upper ceramic substrate 1 is inserted into a through hole of the ceramic substrate 3 and electrically connected to the buried electrode 2. Further, a metal terminal 6a having a conductive member 7 for power supply is threadedly engaged with a screw hole of the ceramic base body 4 and connected to the ceramic-made connection terminal 5a. COPYRIGHT: (C)2009,JPO&INPIT