METHOD FOR FILLING SOLID ORGANIC METAL COMPOUND

PROBLEM TO BE SOLVED: To provide a solid organic metal compound filling method capable of supplying a solid organic metal compound, which is supplied to a manufacturing apparatus of a solid organic metal compound for epitaxial vapor deposition, at a suitable concentration from the initial stage of s...

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Bibliographische Detailangaben
Hauptverfasser:	OSHIMA MITSUYOSHI, OSAKI HIROMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solid organic metal compound filling method capable of supplying a solid organic metal compound, which is supplied to a manufacturing apparatus of a solid organic metal compound for epitaxial vapor deposition, at a suitable concentration from the initial stage of start of use. SOLUTION: In the method for supplying the solid organic metal compound into a container 1 having one or more carrier gas inlet pipes and one or more carrier gas output pipes 3 on an upper part, and after heating and melting the solid organic metal compound at its melting point and more, cooling and filling the solid organic metal compound into the container, valve and pipe portions are heated while decompressing the outlet pile on the upper part of the container of the obtained solid organic metal compound to remove the solid organic metal compound stuck to these valve and pipe portions from the outlet pipe. Thereby the solid organic metal compound filled in the container can be supplied at a suitable concentration from the initial stage of start of use, so that the solid organic metal compound can be immediately used as a vapor deposition material. COPYRIGHT: (C)2009,JPO&INPIT