SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To reduce the number of components, to facilitate a manufacturing process, and to reduce parasitic inductance. SOLUTION: A semiconductor device 1 includes a semiconductor chip 4 arranged between opposing radiator plates 2, 3, where the semiconductor chip 4, the radiator plates...
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| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To reduce the number of components, to facilitate a manufacturing process, and to reduce parasitic inductance. SOLUTION: A semiconductor device 1 includes a semiconductor chip 4 arranged between opposing radiator plates 2, 3, where the semiconductor chip 4, the radiator plates 2, 3 are molded with a resin 5. The semiconductor chip 4 is constituted of an IGBT chip incorporating FWD. COPYRIGHT: (C)2009,JPO&INPIT |
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