RADIATING APPARATUS, MANUFACTURING DEVICE OF SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE

PROBLEM TO BE SOLVED: To achieve balanced optical design capable of sufficiently assuring uniformity in radiation while sufficiently coping with miniaturization of a radiation optical system when radiating a beam using a semiconductor laser as light source. SOLUTION: The radiating apparatus radiates the emitted beam from a semiconductor laser to an object. A first wavefront split type integrator 62 and second wavefront split type integrator 64 are respectively configured to satisfy NA2≤NA1while allowing NA1, P1, NA2, and P2to satisfy a specified relationship. Here, the numerical aperture of the first wavefront split type integrator 62 arranged for uniform radiation is NA1, a split pitch is P1, the numerical aperture of the second wavefront split type integrator 64 arranged closer to the object than to the first wavefront split type integrator 62 is NA2, and split pitch is P2. COPYRIGHT: (C)2009,JPO&INPIT