METHOD FOR MANUFACTURING COPPER-TIN ALLOY PLATED PRODUCT SUPERIOR IN CONTINUAL-IMPACT RESISTANCE

PROBLEM TO BE SOLVED: To provide a method for producing a cyanogen-free type copper-tin alloy plating, which can prevent the formed coating film from causing peeling or cracking due to continually given impacts, even when the coating film has thickness as thick as 2 μm or more, which has been a problem of the cyanogen-free type copper-tin alloy plating. SOLUTION: The method for producing the copper-tin alloy plating superior in continual-impact resistance comprises the steps of: electroplating a base material (1) which is selected from a metal or a ceramic having a metal layer on its surface, or (2) which is selected from plastics having a metal layer on their surfaces, in a copper-tin alloy plating bath that is constituted by at least a soluble copper salt and a soluble stannic salt, an organic acid and/or an inorganic acid and/or a soluble salt thereof, and a specific addition agent (brightener), and does not contain a cyanogen; and baking the base material (1) or (2) on a specific condition which is different between the base materials (1) and (2). COPYRIGHT: (C)2009,JPO&INPIT