SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To reduce the bending of a base board to be generated in the case of manufacturing a semiconductor device having a base board. SOLUTION: A semiconductor structural body 6 is arranged at a plurality of places on a base board 1 configured of a bare silicon board in a wafer state,...

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1. Verfasser: KOTANI SHOICHI
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To reduce the bending of a base board to be generated in the case of manufacturing a semiconductor device having a base board. SOLUTION: A semiconductor structural body 6 is arranged at a plurality of places on a base board 1 configured of a bare silicon board in a wafer state, and a sealing film 17 constituted of epoxy resin is formed on them. In this case, the sealing film 17 is originally liquid, and then hardened by heating. Then, the base board 1 in the wafer state is formed of the same silicon board as a silicon board 8 of the semiconductor structural body 6 so that it is possible to reduce bending to be generated in the base board 1 in the wafer state by heating. COPYRIGHT: (C)2009,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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