SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To reduce the bending of a base board to be generated in the case of manufacturing a semiconductor device having a base board. SOLUTION: A semiconductor structural body 6 is arranged at a plurality of places on a base board 1 configured of a bare silicon board in a wafer state,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KOTANI SHOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce the bending of a base board to be generated in the case of manufacturing a semiconductor device having a base board. SOLUTION: A semiconductor structural body 6 is arranged at a plurality of places on a base board 1 configured of a bare silicon board in a wafer state, and a sealing film 17 constituted of epoxy resin is formed on them. In this case, the sealing film 17 is originally liquid, and then hardened by heating. Then, the base board 1 in the wafer state is formed of the same silicon board as a silicon board 8 of the semiconductor structural body 6 so that it is possible to reduce bending to be generated in the base board 1 in the wafer state by heating. COPYRIGHT: (C)2009,JPO&INPIT