DEVICE AND METHOD FOR MANUFACTURING THIN LAMINATED SUBSTRATE AND THIN LAMINATED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for laminating thin substrates, which can be easily and inexpensively applied and by which face wobbling of the manufactured thin substrates can be reduced. SOLUTION: The method includes a process for placing one thin substrate on a turntable, a process for...

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1. Verfasser: IDO HIROSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for laminating thin substrates, which can be easily and inexpensively applied and by which face wobbling of the manufactured thin substrates can be reduced. SOLUTION: The method includes a process for placing one thin substrate on a turntable, a process for dropping an adhesive on the thin substrate, a process for rotating the turntable to spread the adhesive on the thin substrate, a process for placing the other thin substrate on the thin substrate, a process for clamping the thin substrates by using a clamp pushing a part in a prescribed range of an inner peripheral part of the thin substrates and a part in a prescribed range of an outer peripheral side separated from the part of the inner peripheral part by a prescribed distance and a process for rotating the turntable to centrifuge the adhesive between the two thin substrates. COPYRIGHT: (C)2009,JPO&INPIT