RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition with a high optical transparency, adhesive film and a light-receiving device using the same. SOLUTION: The resin composition, (corresponding to the adhesive film 14), is an optically curable resin composition installed between a base substrate 12...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAYAMA RIE, TAKAHASHI TOYOMASA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition with a high optical transparency, adhesive film and a light-receiving device using the same. SOLUTION: The resin composition, (corresponding to the adhesive film 14), is an optically curable resin composition installed between a base substrate 12 on which the light-receiving device 11 is installed, and a transparent substrate 13, and used for keeping a gap between the base substrate 12 and the transparent substrate 13. The resin composition comprises the optically curable resin and 0.1-40 wt.% of silica having 0.03-0.4 μm of an average particle size. COPYRIGHT: (C)2009,JPO&INPIT