METHOD OF MANUFACTURING SILICON WAFER

PROBLEM TO BE SOLVED: To prevent a decline in productivity of wafers by leaving as small a space as possible between two silicon block pieces. SOLUTION: In the method of manufacturing silicon wafers, prior to slicing a silicon block 18, at least one end face of each of two block pieces 18a and 18b i...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO HISAAKI, KAJIMOTO KIMIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent a decline in productivity of wafers by leaving as small a space as possible between two silicon block pieces. SOLUTION: In the method of manufacturing silicon wafers, prior to slicing a silicon block 18, at least one end face of each of two block pieces 18a and 18b is ground vertically to the central axis of the block pieces 18a and 18b to be flattened in advance. Then, the flattened end faces are butted against each other, and the two block pieces 18a and 18b are sliced vertically to the central axis as one silicon block pair. COPYRIGHT: (C)2009,JPO&INPIT