METHOD FOR MOUNTING FLEXIBLE DRIVER IC AND FLEXIBLE DRIVER IC

PROBLEM TO BE SOLVED: To provide a method for mounting a flexible driver IC which has flexibility and softness and is strong against bending. SOLUTION: In the method for mounting flexible driver IC of mounting on an electrode substrate the flexible driver IC formed on a silicon wafer, an anisotropic...

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Bibliographische Detailangaben
Hauptverfasser: TANUMA ITSUO, SAKURAI MAKOTO
Format: Patent
Sprache:eng
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