METHOD FOR MOUNTING FLEXIBLE DRIVER IC AND FLEXIBLE DRIVER IC

PROBLEM TO BE SOLVED: To provide a method for mounting a flexible driver IC which has flexibility and softness and is strong against bending. SOLUTION: In the method for mounting flexible driver IC of mounting on an electrode substrate the flexible driver IC formed on a silicon wafer, an anisotropic...

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Hauptverfasser: TANUMA ITSUO, SAKURAI MAKOTO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for mounting a flexible driver IC which has flexibility and softness and is strong against bending. SOLUTION: In the method for mounting flexible driver IC of mounting on an electrode substrate the flexible driver IC formed on a silicon wafer, an anisotropic conductive material is arranged between the flexible driver IC and the electrode substrate and, when the flexible driver IC is connected to the electrode substrate by pressure-curing the anisotropic conductive material, the anisotropic conductive material which swells out and is infiltrated to the surroundings or the upper part of the flexible driver IC is used as a protection member of the flexible driver IC. Further, a film material arranged on the upper part of the flexible driver is adhered by utilizing the anisotropic conductive material (ACF), which swells out, and protects the flexible driver IC. COPYRIGHT: (C)2009,JPO&INPIT