WIRE SUPPORT STRUCTURE

PROBLEM TO BE SOLVED: To provide wire support structure hardly causing a wire connection failure even when a tensile force is applied to a wire harness. SOLUTION: In this wire support structure for supporting a wire from a connection spot P to a lead-out spot to the outside by a mold part 6d formed...

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Bibliographische Detailangaben
1. Verfasser: ISHIHARA SHIGEHARU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide wire support structure hardly causing a wire connection failure even when a tensile force is applied to a wire harness. SOLUTION: In this wire support structure for supporting a wire from a connection spot P to a lead-out spot to the outside by a mold part 6d formed by applying resin molding onto the connection spot P between a wire 8 terminal of the wire harness 7 and another conductor 62, the wire 8 has a bending part bent in the middle from the connection spot P to the lead-out spot to the outside. Since the wire 8 is bent, a frictional force with the resin is secured, and a tensile force to the wire 8 can be received by each internal stress in the resin in various directions. COPYRIGHT: (C)2009,JPO&INPIT