ATMOSPHERE EXCHANGE METHOD

PROBLEM TO BE SOLVED: To provide an atmosphere exchange method of reducing the adhesion of particles to a substrate in a vacuum chamber. SOLUTION: There is provided a method for exchanging atmosphere of the vacuum chamber for a processor for processing a substrate in a vacuum environment. The method...

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1. Verfasser: MOCHIZUKI SHINYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an atmosphere exchange method of reducing the adhesion of particles to a substrate in a vacuum chamber. SOLUTION: There is provided a method for exchanging atmosphere of the vacuum chamber for a processor for processing a substrate in a vacuum environment. The method includes a process for holding the substrate; with a holding unit laid within the vacuum chamber and a process for exchanging the atmosphere of the vacuum room by means of discharging or supplying air. In the process for exchanging the atmosphere of the vacuum chamber, pressure in the vacuum chamber is retained to be not lower than 10 Pa and not higher than 10,000 Pa of the pressure of the vacuum chamber for 10 or higher and 600 or lower seconds with the temperature made adjustment to lower temperature than that of the substrate in a dust collection unit that is laid within the vacuum chamber. COPYRIGHT: (C)2009,JPO&INPIT