METHOD AND APPARATUS FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate treating method and a substrate treating apparatus which can obtain a treatment solution with high activity and applying proper treatment, based on the treating solution to a substrate. SOLUTION: Hydrochloric acid and hydrogen peroxide solution are mixed with each other in a second chemical feed pipe 11, and a mixed solution obtained by the mixing and DIW are mixed with each other in a mixing valve 8. Consequently, the mixed solution of hydrochloric acid and the hydrogen peroxide solution is diluted by the DIW and a treatment solution with a concentration which is to be supplied to a wafer W can be obtained. Namely, the hydrochloric acid and the hydrogen peroxide solution respectively held at high concentration states are mixed with each other, before being diluted with the DIW. Consequently, superior chemical reaction of the hydrochloric acid and the hydrogen peroxide solution is generated, and a mixed solution of high activity can be obtained. By appropriately mixing the mixed solution of high activity with the DIW, a treatment solution, having high activity and a concentration suited to the treatment of the wafer W, can be obtained. COPYRIGHT: (C)2009,JPO&INPIT