ELECTRONIC COMPONENT PACKAGING MACHINE

PROBLEM TO BE SOLVED: To provide an electronic component packaging machine capable of more flexibly changing an apparatus configuration in an electronic component packaging line. SOLUTION: The electronic component packaging machine used for an electronic component packaging line for mounting electronic components on a substrate to manufacture a mount substrate is composed of a component mounting operation module 12 on which a component mounting mechanism for executing a component mounting operation for a substrate as a target is disposed; a component carrying module 2 which is detachably attached to the lower part of the component mounting operation module 12 and on which a substrate carrying mechanism 2a for carrying a substrate 3 along a carrying passage is disposed; and a base module 1 having the substrate carrying module 2 detachably placed thereon and holding the substrate carrying module 2 on a predetermined position. This configuration enables the replacement of the component mounting operation module 12 and the substrate carrying module 2 depending on the kind of a substrate, so that the apparatus configuration in the electronic component packaging line can be changed more flexibly. COPYRIGHT: (C)2009,JPO&INPIT