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PROBLEM TO BE SOLVED: To prevent a hillock when an Al cabling is used to lower resistance in the cabling in a display apparatus. SOLUTION: The Al cabling is made a multi-layer structure and an element which does not form a continuous solid solution with Al is added to each layer. Good elements are r...

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Hauptverfasser: UENO TAKAHIRO, YANASE HIROYASU, SHINTANI HIDEYUKI, OGASA TAKAAKI, IKEDA MITSUHARU, KUSUNOKI TOSHIAKI, NISHIMURA ETSUKO, TERAKADO MASAMICHI, TAKASAKI YUKIO, HIRANO TATSUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a hillock when an Al cabling is used to lower resistance in the cabling in a display apparatus. SOLUTION: The Al cabling is made a multi-layer structure and an element which does not form a continuous solid solution with Al is added to each layer. Good elements are rare earth metals such as Nd, dystectic point transition metals such as Ta and noble metal compounds such as Pd. Intermetallics 55 of Al and these elements deposit on interface 151 of the multi-layer cabling and prevents the hillock from being formed by swelling of crystal grains of Al. COPYRIGHT: (C)2009,JPO&INPIT