COMPOSITION FOR CIRCUIT BOARD AND CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a circuit board excellent in stress relaxation, heat resistance, moisture resistance and heat radiating properties. SOLUTION: The composition for the circuit board comprises an epoxy resin having a polyether skeleton in the main chain, a curing agent having an aromat...

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Bibliographische Detailangaben
Hauptverfasser:	INOMATA SUSUMU, TSUJIMURA YOSHIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit board excellent in stress relaxation, heat resistance, moisture resistance and heat radiating properties. SOLUTION: The composition for the circuit board comprises an epoxy resin having a polyether skeleton in the main chain, a curing agent having an aromatic ring and ≥2 primary amino groups on terminals of the main chain and an inorganic filler as essential components. Preferably, the composition for circuit boards includes ≥1 species epoxy resins selected from a group consisting of high molecular weight epoxy resins having a straight main chain and a bisphenol F type or a bisphenol A type skeleton having 800-4,000 epoxy equivalent, polypropylene glycol type epoxy resins, polyethylene glycol type epoxy resins and polytetramethylene glycol type epoxy resins. More preferably, the resin composition after curing has 100-5,000 MPa storage modulus at 300 K. COPYRIGHT: (C)2009,JPO&INPIT