COMPOSITE MULTILAYER SUBSTRATE AND MODULE USING IT

PROBLEM TO BE SOLVED: To solve the following problems caused by use of a glass cloth as a reinforcing material for a substrate: degraded electrical characteristics associated with migration; and increased manufacturing costs due to the need for a process of cutting the glass cloth in forming a cavity. SOLUTION: A composite multilayer substrate 20 comprises: a flat core member 21 formed of a metallic material; a front-side resin layer 22 and a rear-side resin layer 23 that at least respectively cover the front and rear surfaces of the core member 21; and a through hole 24 or a recess that is formed in the core member 21 so as to penetrate the core member 21. An electronic component 25 is mounted in the through hole 24 or the recess. The strength of the composite multilayer substrate 20 is ensured by the rigidity of the core member 21, thereby eliminating the need for a glass cloth. COPYRIGHT: (C)2009,JPO&INPIT