TREATMENT KIT FOR SUBSTRATE TREATMENT CHAMBER

PROBLEM TO BE SOLVED: To provide a treatment kit that reduces the deposition of a depositant material on inside chamber constituent members and on the protruded edge of a substrate. SOLUTION: The treatment kit 200 comprises a shield 201 and a ring assembly 202 each positioned around the circumferenc...

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Hauptverfasser:	HONG ILYOUNG RICHARD, PAVLOFF CHRISTOPHER M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a treatment kit that reduces the deposition of a depositant material on inside chamber constituent members and on the protruded edge of a substrate. SOLUTION: The treatment kit 200 comprises a shield 201 and a ring assembly 202 each positioned around the circumference of a substrate holder in a treatment chamber, wherein the shield 201 is provided with a cylindrical band 214 having an upper wall part that surrounds a sputtering target and a bottom wall part that surrounds a U-shaped channel having the substrate holder, a supporting protrusion, a slanted step part, and a gas conductance hole part, the ring assembly 120 is provided with a deposition ring 208 and a covering 212, and the covering 212 has a valve-type protrusion around the circumference of the ring. COPYRIGHT: (C)2009,JPO&INPIT