PRESSURE-CONTACT POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTTURING THE SAME

PROBLEM TO BE SOLVED: To disclose a pressure-contact power semmiconductor module that can be easily configured and manufactured at a low cost. SOLUTION: This pressure-contact power semiconductor module comprises at least one substrate (12) having a conductive path (18) and a power semiconductor element (20); an assembly basic body (22) wherein the substrate (12) is arranged on the bottom surface (24) which has a recess (26) for permitting the passage of contact feet (28) that pressure-contact with the conductive path (18) therethrough, and where the contact feet (28) stand from a plate (30) of a loading terminal element (38); and a shape stability cover (48) that surrounds the assembly basic body (22) on all side surfaces and is connected to the assembly basic body (22) with a snap lock joint where a fixed hole (52) is formed at the cover (48) and at least one elastic cushion component (42) is bound tight between the cover (48) and the plate portion (30) of the loading terminal element (38). COPYRIGHT: (C)2009,JPO&INPIT