IC CHIP

PROBLEM TO BE SOLVED: To provide an IC chip capable of raising an insulation performance between bumps, when the IC chip is fixed by an ACF. SOLUTION: In bumps 14 which are arranged at a bottom face of an IC chip 12 in a stagger shape, there is provided a gap A between a bump 14 of a primary sequenc...

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Bibliographische Detailangaben
Hauptverfasser:	HASEGAWA TATSUYA, KAMOTO TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an IC chip capable of raising an insulation performance between bumps, when the IC chip is fixed by an ACF. SOLUTION: In bumps 14 which are arranged at a bottom face of an IC chip 12 in a stagger shape, there is provided a gap A between a bump 14 of a primary sequence and a bump 14 of a secondary sequence, and this gap A is set larger than twice the diameter of a conductive particle 20 contained in an ACF 18. COPYRIGHT: (C)2009,JPO&INPIT