PROBE UNIT, PROBING METHOD AND STORAGE MEDIUM

PROBLEM TO BE SOLVED: To provide a technology for touching the electrode pad of a chip to be inspected on a substrate to be inspected and a probe in a probe unit while aligning them in the height direction with high precision. SOLUTION: The coordinate position determined by calculation for a wafer to be measured is corrected by using correction data which associates each of a plurality of reference points on a reference substrate, i.e., each point acquired previously using a reference substrate different from a substrate to be inspected with a correction amount, i.e., the difference between a contact position on a drive system coordinate determined by calculation based on the imaging result of the reference point from an imaging means and an actual contact position in every direction of X, Y and Z. COPYRIGHT: (C)2009,JPO&INPIT