MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which suppresses the difference in color, based on a film thickness of a photosensitive polyimide film. SOLUTION: The method includes a process to measure beforehand the color of photosensitive polyimide, having the sp...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which suppresses the difference in color, based on a film thickness of a photosensitive polyimide film. SOLUTION: The method includes a process to measure beforehand the color of photosensitive polyimide, having the specified film thickness and used as a basis; a process to apply photosensitive polyimide 21 before reformed to a surface of a semiconductor substrate 11 thicker than the film thickness of the photosensitive polyimide used as the basis; a process to irradiate an energy ray 42 to the photosensitive polyimide 21; and a process to perform heat treatment. The process to irradiate the energy ray is performed, in such an exposure quantity as a difference from a physical quantity of the measured color of the photosensitive polyimide used as the basis falls within a predetermined range, based on calibration data which is obtained beforehand on a predetermined heat treatment condition, and shows the relation between at least one physical quantity from among the physical quantities representing the color and the exposure quantity. The heat treatment process is performed to the photosensitive polyimide 21 on the predetermined heat treatment condition. COPYRIGHT: (C)2009,JPO&INPIT |
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