MOUNTING DEVICE

PROBLEM TO BE SOLVED: To reduce a thermal impact to the surroundings, and to mount a mounting component on a substrate at a high positional accuracy. SOLUTION: Gas in a space 100 where an electronic part 71 is arranged, without leaking to the outside, is circulated in a heating furnace 30 through an inlet pipe 22 and a supply pipe 23 to heat a bonding part 71a. Thereby, the thermal impact from the outside space is avoided, and the temperature of the bonding part 71a can be managed correctly according to the temperature profile. Moreover, the optimal temperature profile is formed based on a substrate 70, heat capacity and thermal resistance of an electronic part 71, and a solder component used for the connection, thereby, the electronic part 71 can be soldered (mounted) to the substrate 70 at a high positional accuracy. COPYRIGHT: (C)2009,JPO&INPIT