LOW-TEMPERATURE FIRED CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To improve the productivity of manufacturing a low temperature ceramic circuit board by a restricted firing method without deteriorating the electrical property of wire bonding property or the like. SOLUTION: The low temperature firing ceramic board 11 having a conductor 15 and...

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Bibliographische Detailangaben
Hauptverfasser:	FUKAYA MASASHI, FUKUDA JUNZO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the productivity of manufacturing a low temperature ceramic circuit board by a restricted firing method without deteriorating the electrical property of wire bonding property or the like. SOLUTION: The low temperature firing ceramic board 11 having a conductor 15 and 16 for a wire bonding pad printed with a conductive paste on the outer most layer is fired at the same time with the conductor 15 and 16. After the firing, a residue on a restricted firing green sheet 18 is removed to form a wire bonding pad 24 and 25 by forming a plating film 20 and 21 on the surface of a conductor 15 and 16 for a rough wire bonding pad. COPYRIGHT: (C)2009,JPO&INPIT