PLASMA SPECIES AND UNIFORMITY CONTROL THROUGH PULSED VHF OPERATION

PLASMA SPECIES AND UNIFORMITY CONTROL THROUGH PULSED VHF OPERATION

PROBLEM TO BE SOLVED: To provide a parallel plate type plasma etching system, which can substantially maintain the uniformity of a process, by considering electromagnetic effect which happens in high frequency. SOLUTION: An apparatus for processing a substrate has a chamber, a high frequency power s...

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Hauptverfasser: PANAGOPOULOS THEODOROS, PATERSON ALEXANDER, TODOROV VALENTIN N, HOLLAND JOHN P, HAMMOND EDWARD P IV, HATCHER BRIAN K, KATZ DAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PLASMA TECHNIQUE
PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS
PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a parallel plate type plasma etching system, which can substantially maintain the uniformity of a process, by considering electromagnetic effect which happens in high frequency. SOLUTION: An apparatus for processing a substrate has a chamber, a high frequency power source, and a low frequency power source. The chamber has a first and second electrode disposed therein. The high frequency power source is electrically coupled to either the first or second electrode to supply a first RF signal. The low frequency power source is electrically coupled to either the first or second electrode to supply a second RF signal. The first RF signal is pulsed on and off so as to enhance electron loss in the chamber. COPYRIGHT: (C)2009,JPO&INPIT