WAFER CLEANING AGENT

PROBLEM TO BE SOLVED: To provide a wafer cleaning agent of simple composition, with which oily contaminant and inorganic contaminant can easily and efficiently be cleaned and which is superior in fire security and environmental protection. SOLUTION: Wafer cleaning agent consists of 5 to 25 wt.% of hydrocarbon of saturation or unsaturation with a flash point of 90 to 150°C, 5 to 65 wt.% of mono ether of glycol shown by R1-O-(-CpH2p-O-)q-H (in formula, R1- shows an alkyl group with the number of carbons of 6 to 10, (p) is number of 2 to 3, and (q) is number of 1 to 2), 5 to 30 wt.% of monoether of polyoxyalkylene shown by R2-O-(-R3-O-)r-H (in formula, R2- is an alkyl group with the number of carbons of 8 to 18 or an alkenyl group with the number of carbons of 8 to 18, -R3- is an alkyl group with the number of carbons of 2 to 3, and (r) is number of 4 to 20) and 5 to 25 wt.% of water. Kinematic viscosity at 40°C is not more than 10 mm2/S. COPYRIGHT: (C)2009,JPO&INPIT