Ag POWDER, CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE, AND METHOD OF FABRICATING THE SAME

PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate in which warpage is minimized, and which is so highly reliable that any defective will not arise in a high-temperature and high-humidity load test. SOLUTION: A via conductor is an Ag-based metal conductor containing Pd. The metal conductor, after sintering, becomes a via conductor having an oxygen content of ≥100 ppm. When the sintering shrinkage behavior of the conductive paste is evaluated by the apparatus for thermomechanical analysis under such conditions that in the via conductor section: maximum temperature is 900°C; holding time at the maximum temperature is 30 minutes; and rate of temperature rise is 10°C/min, the metal conductor exhibits such change behavior that the shrinkage amount in the conductive paste from the start of holding is ≤5% during the holding time at the maximum temperature. COPYRIGHT: (C)2009,JPO&INPIT