METHOD OF FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD OF FRACTURING SOLAR CELL, AND THE SOLAR CELL

PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. SOLUTION: In the method of fracturing...

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Bibliographische Detailangaben
Hauptverfasser: SHIMA MASAKI, JINNO HIROYUKI
Format: Patent
Sprache:eng
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