METHOD OF FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD OF FRACTURING SOLAR CELL, AND THE SOLAR CELL

METHOD OF FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD OF FRACTURING SOLAR CELL, AND THE SOLAR CELL

PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. SOLUTION: In the method of fracturing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIMA MASAKI, JINNO HIROYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. SOLUTION: In the method of fracturing a substrate, the dividing grooves 8 are formed so as not to become parallel to the cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, thereby fracturing the semiconductor substrate 1 along the dividing grooves 8. COPYRIGHT: (C)2009,JPO&INPIT