METHOD OF FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD OF FRACTURING SOLAR CELL, AND THE SOLAR CELL

PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. SOLUTION: In the method of fracturing...

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Hauptverfasser: SHIMA MASAKI, JINNO HIROYUKI
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JINNO HIROYUKI
description PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. SOLUTION: In the method of fracturing a substrate, the dividing grooves 8 are formed so as not to become parallel to the cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, thereby fracturing the semiconductor substrate 1 along the dividing grooves 8. COPYRIGHT: (C)2009,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF FRACTURING SEMICONDUCTOR SUBSTRATE, METHOD OF FRACTURING SOLAR CELL, AND THE SOLAR CELL
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