RADIATION CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a radiation curable resin composition suitable for forming a resist film when a glass substrate or a substrate with an insulating film of SiO2, SiN or the like is wet-etched. SOLUTION: The radiation curable resin composition includes: (A) an alkali-soluble resin; (B)...

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Bibliographische Detailangaben
Hauptverfasser:	HASEGAWA SATOMI, MORI KOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a radiation curable resin composition suitable for forming a resist film when a glass substrate or a substrate with an insulating film of SiO2, SiN or the like is wet-etched. SOLUTION: The radiation curable resin composition includes: (A) an alkali-soluble resin; (B) a compound represented by formula (1); (C) a compound having at least one ethylenically unsaturated double bond (other than the compound (B)); and (D) a radiation radical polymerization initiator; wherein n represents an integer of 2-4 and R1represents an n-valent organic group having one or more aromatic hydrocarbon groups. COPYRIGHT: (C)2009,JPO&INPIT