MICROCHIP MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a microchip manufacturing method capable of forming a functional film in the inner surface of a channel and jointing microchip substrates made of resin to one another. SOLUTION: A groove 2 for channels extending along the surface of a microchip substrate 1, made of r...

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Bibliographische Detailangaben
Hauptverfasser:	SEKIHARA MIKIJI, KAMIHIRA MASAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING THEIR RELEVANT APPARATUS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microchip manufacturing method capable of forming a functional film in the inner surface of a channel and jointing microchip substrates made of resin to one another. SOLUTION: A groove 2 for channels extending along the surface of a microchip substrate 1, made of resin, is formed in the surface of the microchip substrate 1. A microchip substrate 4 is a plate-like substrate. Surface roughness Ra of the surface of the microchip substrate 1, other than the inner surface of the groove 2 for channels, is equal to the film thickness T1 of an SiO2film 3 formed in the surface or larger. With the surface in which the groove 2 for channels turned to the inside, the microchip substrates 1 and 4 are overlaid and jointed to each other by applying ultrasonic waves. COPYRIGHT: (C)2009,JPO&INPIT