ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus which can cool a heating element from two directions using two cooling means to improve the cooling efficiency. SOLUTION: A semiconductor device 10 includes a first cooling means which is thermally coupled with a semiconductor element 22 to cool the semiconductor element 22 from one side of the semiconductor element 22 by forcing to circulate the cooling water within a cooler 12. Further, the semiconductor device 10 includes a second cooling means which is housed in a cooling medium holding section 11 to cool the semiconductor element 22 from the other different side of the semiconductor element 22 by ebullient cooling using a liquid cooling medium boiling at specified temperature. In addition, the semiconductor device 10 includes a second connecting tube 32 extending from the cooler 12 to be arranged at the cooling medium holding section 11 for making the cooling water going through the cooler 12 pass through the cooling medium holding section 11, and a condensation section 37 provided on the second connecting tube 32 at the cooling medium holding section 11. COPYRIGHT: (C)2008,JPO&INPIT