OXIDE FILM REMOVAL DEVICE, OXIDE FILM REMOVING COMPONENT HOUSING TRAY, AND OXIDE FILM REMOVING METHOD

PROBLEM TO BE SOLVED: To remove an electrode portion of an electronic component and an oxide film of a solder bump and perform proper soldering in a printed-wiring board assembly line. SOLUTION: An oxide film removal device comprises an oxide film removing brush 8 for coming into contact with the fr...

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Bibliographische Detailangaben
Hauptverfasser:	ONO TATSUYA, ENOGAKI JUNYA, SAKURAI HIDEKAZU, KUSANO RYOTA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To remove an electrode portion of an electronic component and an oxide film of a solder bump and perform proper soldering in a printed-wiring board assembly line. SOLUTION: An oxide film removal device comprises an oxide film removing brush 8 for coming into contact with the front surface of a solder bump 3 of an electronic component and removing an oxide film on the front surface, a brush vibration generator 10 for vibrating the oxide film removing brush 8, and a component absorbing nozzle 4 for allowing the solder bump 3 of the electronic component to be in contact with the oxide film removing brush, and then transferring the electronic component and placing the component on a printed-wiring board 5. COPYRIGHT: (C)2008,JPO&INPIT